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We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI’s new and existing products. This position will be based in San Jose, CA.
Job Description
Advanced package platform development: drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package.
IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.
Power module design: design and optimize power modules for performance, manufacturing, and reliability.
Package design rule: define, maintain, and advance package design rules for emerging package platforms and power modules.
Assembly subcontractor/OSAT...
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