Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

You will lead the physical implementation of High Bandwidth Memory (HBM) products that power artificial intelligence (AI), high‑performance computing (HPC), and data center ’ll shape physical architecture and execution from early design through tape‑out, with a direct impact on first‑pass silicon success.
This role offers broad technical ownership, multi-functional influence, and visibility at the most advanced process and packaging nodes.

Responsibilities will include, but are not limited to:

Lead end‑to‑end physical design for HBM base and memory dies from netlist through GDSII (Graphic Data System II), including floorplanning, power plannin...