Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next-generation process development and empowers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility-creating a workplace where top technical talent can build enduring careers.

Drive development of advanced packaging technologies across:

• Develop and optimize wafer‑level packaging processes (e.g. WLP, FO‑WLP, RDL)
• Drive process improvements in lithography, bumping, and wafer preparation
• Enhance yield, perform...