Job Summary The main responsibilities of the job post is to perform lab analysis to support IC package development, including package materials characterization and package physical failure analysis.
Main Responsibilities - Perform die / package materials & package characterization and physical failure analysis (PFA) to support IC package & technology development.
- Perform lab analysis (such as scanning acoustic microscope (SAM), X‐ray, cross section, scanning electron microscope (SEM), focused‑ion‑beam (FIB) cross sectioning, etc.) to support silicon technology and package development.
- Support lab materials/chemicals supply and administration activities and lab tools maintenance/calibration.
- Perform lab housekeeping to meet the site lab 6S cleanliness standard.
Other Responsibilities The candidate is expected to keep learning through work to keep pace with fast‑changing technologies and processes, to work overti...