Optimize die bonding pad, flip chip die plot, and substrate layout to streamline design complexity and reduce cost for ASIC and SiP packaging solutions, including SSD/PSSD NAND BGA, uSD, SD/SD express and USB products.
Support the development and integration of new planform packaging technologies/new NAND generation, new ASIC, Emphasis is placed on interposer/substrate/board co-design, design rule definition, and cross-functional collaboration.
Conduct substrate layout feasibility studies, die fitment analysis based on Org. playbook, and prepare comprehensive design documentation.
Maintain and manage design libraries, and generate accurate bonding diagrams to support layout and assembly processes.
Collaborate closely with hardware, assembly, and packaging engineering teams across multiple Sandisk sites to enable new product development and continuous substrate design improvement.
Interface with ass...
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