• Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)
  
• Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time
  
• Establish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules
  
• Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance
  

Requirements

• Bachelor’s degree in Mechanical Engineering,Physics, Material Science, or a related field of study
  
• Minimum 5 years-experience in the semiconductorfield
  
• Expert level experience in process development forpower stage, mu...