MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking an Engineer, Package–Silicon Integration to support NAND package and silicon integration for next-generation memory products. This role, designed for early-career engineers, offers structured exposure to semiconductor technology and collaboration within teams.

You will engage in chip-package interaction assessments, assist in various tasks with engineers, participate in DFMEA activities, and support investigations related to yield and quality in manufacturing.