Piper Companies is looking for a IC Package Design Engineer to join a cutting-edge start up onsite Monday through Friday near San Jose, CA. The ideal IC Package Design Engineer will lead the physical layout of advanced multi-die substrates that integrate multiple chiplets into a high-density, high-performance package.
Responsibilities for the IC Package Design Engineer:
Lead the physical layout of complex multi-die substrates while supporting chiplet-based integration.Collaborate with package integration, signal/power integrity, and mechanical teams to ensure successful layout implementation.Drive routing feasibility and co-design alignment with floor planning, mechanical, and system constraints.Own the full layout process, ensuring performance, manufacturability, and design quality.Use industry-standard tools like Siemens Xpedition and Cadence Allegro APD to execute and refine substrate designs.Qualifi...