New Package Technology and New Platform Module Development
Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
Good understanding of MRS and generate PRS with SCD definition.
Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
Familiar with DFM, to secure robust manufacturability with quality requirements.
Good understanding of power module package design rule, design rule update with new platform development.
Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
Strong knowledge and in-depth understanding of devi...
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