•Defines, develops and qualifies new wire bonded as well as flip chip semiconductor packages with subcontractors and maintains quality of existing packages. ·    

•Manages next generation packaging technologies with internal R&D teams and eternal technology partners  

•Works closely with the various business units within the company to understand future product needs and suggest packaging solutions.

•Drive yield improvement and better efficiency of subcontractors operation  

•Manages the entire life cycle of packages from path finding all the way to qualification and HVM

•Master degree in Electrical Engineering, Chemical Engineering, 

  Material Science, Physics, or a related engineering discipline

•Excellent communication and interpersonal skills is required

•Strong problem-solving and analytical skills would be highly

  de...