As anEngineer, Package–Silicon Integration in Micron’sPackage Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products.

In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities. You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives.

This position is designed for early‑career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment.

• Supportchip‑package interaction ...