This role leads end-to-end integration of advanced semiconductor packaging platforms, with emphasis on 2.5D, 3D, and heterogeneous system integration. You will own the post-fabrication value chain—from wafer-level processes through assembly, qualification, and reliability—supporting high-performance applications in AI, HPC, networking, and automotive systems.

• Architect and integrate post-FAB assembly flows , ensuring seamless transition from wafer fabrication to package-level execution
• Define and standardize Manufacturing Test Specifications (MTS) and Process Reference Plans (PRP)
• Drive cross-functional alignment across design, process, reliability, and manufacturing teams

• Lead development and commercialization of 2.5D/3D/3.5D packaging platforms , including heterogeneous multi-die inte...